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Microelectronic packaging technology materials and processes : proceedings of the 2nd A S M International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, U S A, 24-28 April 1989 edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of A S M International
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Copyright Title

Microelectronic packaging technology materials and processes : proceedings of the 2nd A S M International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, U S A, 24-28 April 1989 edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of A S M International

Status

Published

on 14 Jun 2007
Year of Creation
1989
Copyright Claimant
A S M International
Registration Number
TX0002662983
on 14 Jun 2007

Copyright Summary


The U.S. Copyright record (Registration Number: TX0002662983) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Microelectronic packaging technology materials and processes : proceedings of the 2nd A S M International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, U S A, 24-28 April 1989 edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of A S M International" created in 1989. The copyright holder is A S M International, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to A S M International.

Copyright Details


Copyright Claimant
A S M International

Application Details


Registration Number
TX0002662983
Registration Date
6/14/2007
Year of Creation
1989
Place of First Publication
Metals Park, Ohio
Publisher Name
ASM International
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
ASM International. Electronic Materials and Processing Division ASM International Electronic Materials and Processing Congress, 2nd, Philadelphia, 1989
Physical Description
479 p

Personal Authors


Notes


Local Copyright Note: C.O. correspondence
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