Text Registration
Copyright Title
Lead Free Solder
Status
Published
on 3 Jan 2012
Year of Creation
2011
Copyright Claimant
Springer Science+Business Media, LLC
Registration Number
TX0007477774
on 3 Jan 2012Copyright Summary
The U.S. Copyright record (Registration Number: TX0007477774) dated 3 Jan 2012, pertains to an electronic file (eService) titled "Lead Free Solder" created in 2011. The copyright holder is Springer Science+Business Media, LLC, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to Springer Science+Business Media, LLC.
Application Details
Registration Number
TX0007477774
Registration Date
1/3/2012
Year of Creation
2011
Agency Marc Code
DLC-CO
Record Status
Changed
Physical Description
Book, 175 p
First Publication Nation
United States
ISBN
978-1-4614-0462-0
Statements
Application Title Statement: Lead Free Solder
Author Statement: John Hock Lye Pang Domicile: not known Citizenship: not known Authorship: text
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