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Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly Jennie S. Hwang
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Copyright Title

Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly Jennie S. Hwang

Status

Published

on 13 Jun 2007
Year of Creation
1989
Registration Number
TX0002547820
on 13 Jun 2007

Copyright Summary


The U.S. Copyright record (Registration Number: TX0002547820) dated 13 Jun 2007, pertains to an electronic file (eService) titled "Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly Jennie S. Hwang" created in 1989. The copyright holder is VanNostrand Reinhold, a division of International Publishing Corporation, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to VanNostrand Reinhold, a division of International Publishing Corporation.

Application Details


Registration Number
TX0002547820
Registration Date
6/13/2007
Year of Creation
1989
Place of First Publication
New York
Publisher Name
VanNostrand Reinhold
Agency Marc Code
DLC-CO
Record Status
New
Physical Description
456 p

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